Compact BGA sockets suit test, debug devices

Compact BGA sockets suit test, debug devices

The surface-mount Mod5 Series Flip-Top BGA sockets suit test, validation, and debug for 0.50-mm-pitch devices used in handheld and wireless applications. The 20 x 27-mm sockets can accommodate packages to 12 mm sq (22 x 22 rows), and require no tooling or mounting holes in the target PCB.

The sockets also feature precision-machined solder balls and metallic spring probes with a system life of 200,000 cycles minimum. The devices also offer easy actuation, with a simple cover and turnscrew heat sink, that enables quick insertion and extraction. Additional mounting options and custom designs are also available. (Contact company for pricing and availability.)

Advanced Interconnections , West Warwick , RI
Customer Service 800-424-9850

http://www.advanced.com