Articles For Ironwood Electronics

Functional testing of 0.3mm pitch Wafer Level Packages to Multi-GHz Speed made possible by Innovative Socket Technology

03-14-2016

200-ball BGA socket has same footprint as IC

03-09-2016

Heat Sinking through socket contact technologies

02-19-2016

Breakout test board handles fine-pitch, high-speed flex modules

12-23-2015

Socket targets hi-/lo-temp test of 18-lead flex devices

11-18-2015

Socket accepts wafer-level chip-scale package

10-29-2015

High Frequency testing of 0.5mm pitch LGA20 is made easier with PB-LGA20A-Z-01 Socket Probe Adapter with SMA connectors

07-22-2015

Clamshell BGA socket with Bluetooth temperature monitoring

06-16-2015

Socket for 0.4-mm pitch, 6×9 BGA packages handles 75 GHz

05-20-2015

IC Socket- Carrier for Semiconductor Devices in Finished Product

04-07-2015