The Sarcon SPG-30A high-viscosity, thermal interface silicone compound offers a thermal conductivity of 3.2 W/mK, and is designed to efficiently transfer heat from a board-level source to a heat sink or heat spreader. Suited for gap-filling around fragile circuit board solder points, the compound exhibits near-zero compression force and can conform to all component shapes and sizes.
No heat curing required, the compound will not cause corrosion on metal surfaces, and maintains all initial properties across a temperature range of -40° to 150°C. Available in 30-ml tubes, 330-ml cartridges and 10-l pails. (Contact Fujipoly for pricing and availibility.)
Fujipoly America , Carteret , NJ
Information 732-969-0100
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