Computer-on-modules deliver 39 TOPS AI performance

Congatec has introduced a new line of COM Express Compact computer-on-modules (COMs) with AMD Ryzen Embedded 8000 Series processors, featuring up to eight ‘Zen 4’ cores, an XDNA NPU and Radeon RDNA 3 graphics. The combination yields a performance of up to 39 tera operations per second (TOPS) to meet AI inference requirements.

(Source: congatec)

The new conga-TCR8 COMs target  high-volume, price-sensitive applications that require advanced AI, graphics and computing power, such as medical imaging, test and measurement, AI-based POS/POI systems and professional gaming. A scalable TDP range of 15 to 54 watts allows the modules to be used for upgrading existing designs.

“Our new AMD Ryzen Embedded 8000-based modules not only expand our range of high-performance edge AI platforms for innovative applications, but also offer developers easy access to system consolidation benefits in the aReady.COM variant,” said Martin Danzer, director product management at congatec, in a statement. “This new processor platform, featuring powerful CPU, GPU, and NPU cores, is perfectly suited for such consolidation.”

Reliability, efficiency, and cost benefits are a result of a configured hypervisor, pre-installed operating systems, IoT software for greater functionality and flexible expansion options, the company said.

Available with four different Ryzen Embedded 8000 processors, the conga-TCR8 COMs support up to 128-GB DDR5-5600 memory with error correction code for data-intensive and data-critical applications. Integrated AMD XDNA NPU (16 TOPS) and AMD RDNA 3 graphics also can be used as a GPGPU for AI tasks with up to 12 compute units for a combined computing power of up to 39 TOPS. They support immersive graphics output for up to four displays and resolutions up to 8k.

For fast peripheral connectivity, the modules offer six PCIe Gen 4, three DisplayPort interfaces, one eDP or LVDS, four USB 3.2 Gen 2 ports and four USB 2.0 ports. Other interfaces include SPI, UART, I2C and GPIO.

(Source: congatec)

The new modules are available in the variants shown above and are also available as application-ready aReady.COMs with custom pre-installed and validated operating systems as well as IoT connectivity via aReady.IOT. These modules can be pre-installed with the customer’s application for simple plug-and-play integration into the finished system. Services include board support packages, evaluation and production-ready application carrier boards, customized cooling solutions, documentation, training and high-speed signal integrity measurements.