The EP30BN two-part boron nitride epoxy adhesive provides thermal management for heat-generating components. It is a medium-viscosity epoxy system that suits bonding, sealing, and potting applications. The adhesive optimizes heat dissipation of aerospace, defense, and microelectronic assemblies with minimal weight penalty. It cures at room temperature or more rapidly at elevated temperatures to a tough, thermoset, dimensionally stable plastic.
The epoxy adhesive provides electrical insulation properties with a volume resistivity of 1,014 Ω-cm and a thermal conductivity of 24 BTU/hr/ft2 /°F/in. The mechanical strength properties and chemical resistance are maintained from –60° to 300°F. (Contact Rachel Ruchama at 201-255-0064 or rruchama@masterbond.com for pricing and availability.)
Master Bond , Hackensack , NJ
James Brenner 201-343-8983
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