By Gina Roos, editor-in-chief
TE Connectivity (TE) recently unveiled its Octal Small Form Factor Pluggable (OSFP) connector and cable assembly portfolio, targeting next-generation data center requirements for data rates of 200 Gbits/s and 400 Gbits/s. They support the latest 8×28G NRZ and 8×56G PAM-4 protocols, with a roadmap to support 8×112G PAM-4 for future system upgrades. Applications include servers, routers, switches, and storage equipment.
TE said that by leveraging integrated thermal heat sink technology, the OSFP family provides superior thermal performance and signal integrity required for 400-Gbits/s data rates. The OSFP products can fit up to 36 400G ports into a 1RU switch form factor to meet next-generation switch silicon roadmaps.
The OSFP portfolio includes surface-mount connectors, 1 × 1 and 1 × 4 cages, and straight and breakout passive copper cable assemblies in multiple configurations as well as various lengths and gauges. The OSFP products are optimized for front-to-back and back-to-front airflow and are designed for up to 15-W thermal loads with low airflow.
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