The ChiP bus converter modules (BCM) supply 1.2 kW at 48 V with 98% peak efficiency and 1,880-W/in.3 power density. This performance is 4x the density of competing solutions and enables efficient, high-voltage dc-distribution infrastructure in datacenter, telecom, and industrial applications.
The dc/dc converter module features advanced magnetic structures integrated within high-density interconnect substrates with power semiconductors and control ASICs. It features an input range from 260 to 410 V, and supports outputs ranging from 32.5 to 51.25 V. The converters operate at a 1.25-MHz switching frequency. The modules measure 63 x 23 x 7.3-mm and are initially offered as a through-hole device. They may be paralleled to provide multi-kilowatt arrays and provide features include under-/over-voltage lockout, overcurrent, short-circuit, and overtemperature protection.
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