The PC-BGA256B/BGA256E-B-01 package converter allows older BGA devices to be used on newer system boards for test/validation. The RoHS-compliant converter consists of a multilayer PCB with a SAC305 solder ball for SMT processing.
Pin mapping from top to bottom footprint is 1:1. The converter is designed to receive a 23 x 23-mm BGA, 16 x 16 array, 1.27-mm pitch on the top, and it converts 1:1 pin mapping to a 17 x 17-mm BGA, 16 x 16 array, 1-mm pitch on the bottom. The converter can be reversed by removing solder balls from the 1-mm pitch side and adding them to the 1.27-mm pitch side. ($315 each — available now.)
Ironwood Electronics , Burnsville, MN
Ila Pal 800-404-0204
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