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CoolSiC MOSFETs target hi-rel applications

Infineon’s 750-V G1 CoolSiC MOSFETs address requirements for higher efficiency and power density in industrial and automotive power applications.

Infineon Technologies AG has unveiled the 750-V G1 discrete CoolSiC MOSFET family, addressing the need for higher efficiency and power density in industrial and automotive power applications. This family includes industrial-grade and automotive-grade SiC MOSFETs that are optimized for totem-pole PFC, T-type, LLC/CLLC, dual active bridge (DAB), HERIC, buck/boost and phase-shifted full-bridge (PSFB) topologies. Their design delivers lower conduction and switching losses, which increases overall system efficiency.

Infineon's 750-V G1 discrete CoolSiC MOSFET in a QDPACK TSC package.

(Source: Infineon Technologies AG)

These CoolSiC MOSFETs can be used in industrial applications, including industrial drives, solar and energy storage systems, solid-state circuit breakers, UPS systems, servers/data centers and telecommunications. For automotive, they are suited for applications such as electric vehicle (EV) charging, onboard chargers (OBCs) and DC/DC converters.

Infineon said the CoolSiC MOSFET 750-V G1 technology features excellent RDS(on) × Qfr and superior RDS(on) × Qoss figure-of-merits (FOMs), delivering ultra-high efficiency in hard-switching and soft-switching topologies. The combination of high threshold voltage (VGS(th), Typ. of 4.3 V) with low QGD/QGS ratio ensures protection against parasitic turn-on and enables unipolar gate driving, with the benefits of increased power density and lower system costs.

The devices in the portfolio range from 8 to 140-mΩ RDS(on) at 25°C, meeting a wide range of applications. Their packages minimize thermal resistance for improved heat dissipation and optimize in-circuit power loop inductance, also contributing to higher power density and lower system costs.

The CoolSiC MOSFET 750-V G1 MOSFETs for automotive applications are available in QDPAK top-side cooled (TSC), D2PAK-7L and TO-247-4 packages. Industrial-grade MOSFETs are available in QDPAK TSC and TO-247-4 packages. Infineon is showcasing its CoolSiC and CoolGaN products at APEC 2024, booth #1013 and #1319. Upcoming webinars will address automotive charging using silicon, SiC and GaN technologies.

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