Copper substrates suit high-current apps

Using a screen-printing process where copper traces are printed on an alumina ceramic substrate and fired at temperatures up to 1,000°C, the TFC Series solderable thick-film copper substrates suit high-current and power-module applications. The substrates feature an adhesive copper strength greater than 20 N/mm2 , thermal expansion of 7.3 ppm/°C, and low thermal impedance.

Conductor thickness ranges from 20 to 250 µm, and minimum conductor width and space between conductors is 0.5 mm. When integrated onto the substrate, resistance is down to 0.001 Ω with tolerances to ±1%. Offered in sizes up to 4.5 x 6.25 in., the substrates come in thicknesses from 0.25 to 1.0 mm. (Contact Tom Morris for pricing—available now.)

IRC , Corpus Christi , TX
Tom Morris 361-985-3140

http://www.irctt.com/anotherm