The EP29LPSP is a two-component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. It is serviceable from 275°F to 4K, the system for bonding, sealing, coating, potting and casting is NASA low outgassing approved.
It is capable of withstanding cryogenic shocks (room temperature to liquid helium in a 5 to 10 minute time period). It has an advantageous low mixed viscosity of 500-1,5—cps and is frequently employed in potting/casting applications. Electrical insulation properties are outstanding. Volume resistivity is greater than 1015 ohm-cm.
EP29LPSP is solvent free and ROHS compliant. Bond strength to metals, glass, ceramics, composites, rubber and most plastics is excellent. It also features optical clarity, superb chemical resistance, low exotherm, a Shore D hardness greater than 65 and tensile strength greater than 8,000 psi.
Working life for a 100 gram mass is 4 to 5 hours at room temperature. Its mix ratio is 100 to 65 by weight. EP29LPSP will gel at ambient temperature. It will cure at 175°F in 5 to 7 hours or 3 to 5 hours at 200°F.
This epoxy is vacuum compatible and can be used in both ambient and cryogenic environments. Typical ambient type applications include thin film heads, mass spectrometers, x-ray analysis, surface analysis, MEMS, and semiconductor process equipment. Cryogenic applications include satellite tracking systems, infrared detectors, cryogenic pumps, optical windows, dilution and refrigeration units, and chromatography.
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