DOE relates spring probe variables to signal integrity

DOE relates spring probe variables to signal integrity

One of the modern world’s driving engines is the semiconductor also referred to as the IC (Integrated Circuits). These ICs are fabricated, assembled and tested in billions of units every year. The semiconductor industry is being driven by the mantra “small, fast and cheap”. Testing challenges grow largely due to smaller size and faster performance (bandwidth) of IC devices. The socket industry that enables testing of semiconductor devices is heavily taxed by smaller and faster devices in addition to the other supporting segments of the semiconductor market. IC device manufacturers and test houses require reliable socket solutions for these high performance devices. Smaller and faster devices are typically more sensitive to changes in the electrical configurations used for testing, particularly in the case of AC performance often referred as “signal integrity”. ■