Elpida Memory’s 512 Megabit Mobile RAMTM Device Fits in Smaller Package for 3G Phones

Elpida Memory's 512 Megabit Mobile RAMTM Device Fits in Smaller Package for 3G Phones

Elpida Memory, Inc. (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has started shipping samples of small form-factor, 512 Megabit Mobile RAM devices for high-performance, 3G cellular applications.

90 nm Process Technology Enables Smaller Die Size, Easier Implementation in Multi-Chip-Package and System-in-Package Designs

By utilizing 90 nm process technology, Elpida can now offer customers 512 Megabit Mobile RAM devices with a smaller and square die for easier implementation into Multi-Chip Package (MCP) and System-in-Package (SiP) designs which require 11 x 11 mm packages or smaller to save valuable board space.

“As feature-rich cellular phones become more mainstream, the demand for high-density Mobile RAM is steadily increasing,” said Akira Yabu, manager of Technical Marketing at Elpida Memory (USA). “Elpida's 512 Megabit devices with 90 nm design geometry are ideal for supporting handset systems with real-time operating systems such as Linux, Symbian or Windows CE that require high-density memory, but have limited space.”