The 21st annual embedded world 2023 Exhibition & Conference in Nuremberg, March 14-16, hosts hundreds of exhibitors from dozens of companies that are showcasing their latest innovations in embedded system development. Key themes at this year’s show include IoT, wireless technologies, edge AI, safety and security, system-on-chip (SoC) design, and data centers.
Many of these themes and trends are highlighted with the most recent product launches for processors, microcontrollers (MCUs) and SoCs. These devices pay particular attention to providing designers with higher integration and higher performance that deliver greater flexibility and ease of design. Many of them also focus on packing higher performance in smaller packages, in particular for wearables and other space-constrained applications. Energy savings also is a big trend as the industry continues to support a more sustainable and greener world.
Here is a sampling of those new product launches.
MPUs and MCUs
Delivering greater design flexibility for high-reliability applications that require high standards for safety and security, Infineon Technologies AG has extended the support of its AURIX TC3x and TRAVEO T2G MCU product families from ISO 26262 automotive functional safety to IEC 61508 metrics for industrial safety applications. These devices enable safety integrity level (SIL) up to SIL 3.
AURIX TC3x and TRAVEO T2G MCUs (Source: Infineon Technologies)
Both product families now support IEC 61508 hardware and software metrics, including all documentation required for functional safety certification. Infineon’s AUTOSAR Microcontroller Abstraction Layer (MCAL) low level driver software product also supports the IEC 61508 metrics.
In addition to the mobility market, the AUTOSAR MCAL now enables other functional safety applications including medical devices, industrial drives, programmable logic controllers (PLCs), robotics and indoor applications such as elevators or machinery. The new support enables developers to achieve SIL-1-3 for their industrial applications.
Infineon said this allows developers to use the proven AURIX and TRAVEO families for safety-critical applications with the diagnostic analysis documentation.
Along with the AURIX TC3x and TRAVEO T2G microcontrollers, Infineon also will feature its products and solutions for decarbonization and digitalization, at Hall 4A, booth #138.
The latest devices in the RA family of MCUs from Renesas Electronics Corp. deliver high performance, high power efficiency and security in a small package. The company expanded its 32-bit RA MCU family with two new entry-line groups based on the Arm Cortex-M33 core with Arm TrustZone technology.
Renesas’s RA4E2 and RA6E2 MCUs (Source: Renesas Electronics Corp.)
The new 100-MHz RA4E2 Group and 200-MHz RA6E2 Group offer 128 Kbyte and 256 Kbyte flash options and 40 Kbytes of SRAM with lots of connectivity options such as on-chip CAN FD, USB, QSPI, SSI and I3C interfaces. They offer an upgrade path to other members of the RA family and are suited for a range of applications such as sensing, gaming, wearables and appliances thanks to their high performance in small packages.
Renesas said the RA4E2 and the RA6E2 are the most cost-effective RA devices with integrated CAN FD and are available in a 4 × 4 mm 36-pin BGA and a 5 × 5 mm 32-pin QFN. They also offer low power consumption for energy savings.
Featuring a 100-MHz Arm Cortex-M33 CPU core, the RA4E2 Group includes five different options, spanning from 32-pin to 64-pin packages as small as 4 x 4mm, and 128 kB of flash memory and 40 kB of SRAM. Power consumption is 82 µA/MHz while executing from Flash at 100 MHz. The extended operating temperature range is -40°C to 105°C. Other features include an internal oscillator, advanced analog, low-voltage detection and internal reset function, along lots of GPIOs and communications options including USB 2.0 Full-Speed Device, SCI, SPI, I3C, HDMI CEC, SSI and CAN FD.
The RA6E2 Group MCUs feature a 200-MHz Arm Cortex-M33 CPU core. The group includes 10 different parts, and similar to the RA4E2 offers options spanning from 32-pin to 64-pin in packages as small as 4 × 4mm, 128 kB to 256 kB of flash memory and 40 kB of SRAM. They offer extensive peripherals, including an integrated timer and advanced analog, and connectivity options, including USB 2.0 Full-Speed Device, SCI, SPI, I3C, HDMI CEC, SSI, QSPI and CAN FD. Power consumption is 80 µA/MHz while executing from Flash at 200 MHz.
All RA devices are supported by the Renesas Flexible Software Package (FSP) that includes drivers and middleware for easier implementation of communications and to improve the functionality of peripherals. With FSP use, designers also have access to the full Arm ecosystem as well as Renesas’ partner network for a wide range of tools.
All the new RA4E2 and RA6E2 MCUs are available now along with separate evaluation kits and fast prototyping boards. Renesas also developed a full Add-on Voice User Interface (VUI) Solution Winning Combination reference design using the RA6E2 MCU and other compatible devices from the Renesas portfolio. Renesas said the solution is modular and can be added to any application that needs a voice user interface.
Renesas will showcase the new RA4E2 and RA6E2 devices in Hall 1, Stand 234. The company also will show the first live demonstrations of artificial intelligence (AI) and machine learning (ML) implementations on an MCU based on the Arm Cortex-M85 processor and Arm Helium Technology. It is said to be the first demonstration of working silicon based on the Arm Cortex-M85 processor.
Renesas and Arm Cortex-M85 processor demo (Source: Renesas Electronics Corp.)
The first demonstration is a people detection application developed in collaboration with Plumerai, a provider of Vision AI, that identifies and tracks persons in the camera frame in varying lighting and environmental conditions. The TinyML models used in this application deliver low-cost and lower power AI solutions for a range of IoT implementations. The second demo highlights a motor control predictive maintenance use case with an AI-based unbalanced load detection application using Tensorflow Lite for microcontrollers with CMSIS-NN.
Renesas said it will implement the new Arm processor within its RA (Renesas Advanced) family of MCUs. Like all RA MCUs, the new devices will be supported by Renesas’s FSP.
The new Cortex-M85 core supports Arm TrustZone technology for protection of secure assets and when combined with the company’s integrated cryptographic engine, immutable storage, key management and tamper protection against DPA/SPA side-channel attacks it will provide a fully integrated secure element functionality, said the company. The Armv8-M architecture also offers Pointer Authentication/Branch Target Identification (PAC/BTI) security extension, a new architectural feature that provides enhanced mitigation from software attack threats and helps achieve PSA Certified Level 2 certification.
Moving to data centers, AMD is delivering the performance of its fourth generation AMD EPYC processors to embedded networking, security, storage and industrial systems. The new energy-efficient EPYC Embedded 9004 Series offers scalability up to 96 cores and enhanced security.
AMD EPYC Embedded 9004 Series processors (Source: AMD)
The new fourth generation devices are powered by the “Zen 4” architecture, which provides technology and features for embedded networking, security/firewall and storage systems in cloud and enterprise computing and industrial edge servers for the factory floor.
The series offers a lot of options with 10 processor models. Performance options range from 16 to 96 cores, and a thermal design power (TDP) profile ranging from 200 W to 400 W. This scalability and flexibility enable embedded system OEMs to develop products across a range of performance and pricing options. In addition, the enhanced security features help maintain a secure compute environment from power-on to run time, making them well suited for applications with enterprise-class performance and security needs, said the company.
The AMD EPYC Embedded 9004 Series processors are sampling now with production expected in April 2023. Evaluation kits featuring a reference board, documentation and development tool kits are available now to qualified customers. AMD is showcasing its latest hardware and software technologies in Hall 2, Stand 2-411. In addition to the EPYC Embedded 9004 Series processors, also on display are the Ryzen Embedded devices, Kria SOMs and Zynq and Versal adaptive SoCs powering industrial, vision, automotive and health-care-based applications.
Focused on providing faster and more secure NFC transactions, NXP Semiconductors has launched its PN7642, a single-chip connected microcontroller (MCU) that integrates an Arm Cortex-M33, an NFC reader and SESIP-Level 2 security. Target applications include physical access solutions, consumables authentication, secure identity verification and other NFC use cases.
PN7642 connected MCU (Source: NXP Semiconductors)
“NFC has become an essential element for secure authentication, for both people and goods,” said Alasdair Ross, senior director, NFC IoT Security, NXP, in a statement.“ By combining a customizable MCU with an NFC Forum-certified NFC solution and a complete security toolbox, the PN7642 makes it easier to integrate NFC technology into new or existing secure authentication solutions.”
The PN7642 consists of a high-performance NFC Forum-Certified NFC reader with 2-W output power, supporting read/write and card emulation modes, and an integrated customizable Arm Cortex-M33 MCU that includes 180-kB flash, 20-kB RAM and a range of controller and host interfaces. For security, the connected MCU includes SESIP-Level 2 certification, a complete security toolbox, crypto accelerators and secure key storage, all supported by software.
Other features include a power supply from 2.4 V to 5.5 V, support for ECP 2.0 and ultra-low-power card detection (22-µA type). The PN7642 also integrates a DC/DC that allows for a single 3.3-V supply with maximum transmit power.
The PN7642 is housed in a VFBGA64 package, measuring 4.5 × 4.5 × 0.8 mm. The company is exhibiting in Hall 4A, booth #222.
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Wireless and IoT chips
Infineon Technologies AG’s latest AIROC device, the ultra-low-power CYW43022 dual-band Wi-Fi 5 and Bluetooth combo chip, tackles all the big challenges in wireless – size, power consumption and battery life. Thanks to the ultra-low-power architecture, the CYW43022 Wi-Fi + Bluetooth combo is said to offer up to a 65% reduction in power usage during deep sleep, extending battery life in applications such as smart locks, smart wearables, IP cameras and thermostats.
Infineon’s AIROC CYW43022 combo chip (Source: Infineon Technologies)
The AIROC CYW43022 combo chip includes Wi-Fi network offloads and an embedded Bluetooth stack, which reduces power demands on host processors, said Infineon. It also features a Class 1 Bluetooth PA with +18-dBm transmit power to support designs with smaller antennas or designs that need a longer reach. For protection against hackers, the combo chip provides secure boot with firmware image authentication that requires signed Infineon firmware.
The AIROC wireless product family including Wi-Fi, Bluetooth, Bluetooth Low Energy and Wi-Fi and Bluetooth combos, use a common software framework across Android, Linux and RTOS platforms and are pre-integrated with Infineon’s ModusToolbox software and tools. This allows designers to develop differentiated products that meet time to market and budget requirements, said the company.
The AIROC CYW43022 is available now. Infineon will showcase the new combo chip in hall 4A, booth #138 and virtually.
Another space-saving and low power consumption device is Onsemi’s NCV-RSL15 automotive MCU. This ultra-low-power automotive-grade wireless microcontroller with Bluetooth Low Energy connectivity also addresses security concerns with the latest embedded security features. It targets vehicle manufacturers that are increasingly using wireless connectivity to reduce the cost and weight of cabling as the number of sensors and in-vehicle communication grows, said the company. Applications include vehicle access, tire monitoring systems and seat belt detection.
Onsemi’s NCV-RSL15 automotive MCU (Source: onsemi)
The NCV-RSL15 incorporates the latest in embedded security with the Arm CryptoCell featuring hardware-based root-of-trust secure boot, many user-accessible hardware-accelerated cryptographic algorithms, and firmware-over-the-air (FOTA) capabilities to enable future firmware updates and deployment of security patches.
The NCV-RSL15, housed in a QFNW40 package, also tackles power consumption. Even though sensing applications continue to grow, the power consumption budget has not increased, said onsemi. Another challenge is the growing requirement for a 10-year battery lifetime.
Addressing these challenges, the NCV-RSL15 is certified by the EEMBC as the industry’s lowest power secure wireless microcontroller, according to onsemi. It features a proprietary smart sense power mode and is designed to use as little power as possible. A side benefit of conserving more battery is increased product longevity.
Onsemi offers a software development kit with a library of sample code. The company is in Hall 4A, booth #260.
If you’re looking for an extremely tiny Bluetooth SoC and MCU for IoT devices, Silicon Labs has claimed the smallest form factor with the introduction of the xG27 family of Bluetooth SoCs and the BB50 MCU.
Silicon Labs Silicon Labs XG27 SoC (Source: Silicon Labs)
The xG27 and BB50 families range in size from 2 mm-squared, about the width of a #2 pencil lead, to 5 mm-squared, less than the width of a standard #2 pencil. In addition to their small size, they deliver energy efficiency, high performance, trusted security and in the case of the xG27 family, wireless connectivity.
These features make the xG27 SoC family and BB50 MCU suited for tiny, battery-optimized devices like connected medical devices, wearables, asset monitoring tags, smart sensors and simple consumer electronics like toothbrushes and toys. Lura Health, for example, is using the BG27 SoC to develop a sensor that is smaller than a tooth to collect salivary data, which is used to test for over 1,000 health conditions. The health monitor is so small that it can be glued to a tooth.
BG27 Bluetooth SoC (Source: Silicon Labs)
The new xG27 family is comprised of the BG27 for Bluetooth connectivity and the MG27, which supports Zigbee and other proprietary protocols. Both devices are built on the ARM Cortex M33 processor and share several common features, including wafer-level chip-scale packaging as small as 2.3 × 2.6 mm, which make them suited for medical patches, continuous glucose monitors, wearable electrocardiograms and asset tags.
Other shared features include an integrated DC/DC boost that allows devices to operate on batteries as low as 0.8 V, resulting in smaller device sizes and cost; an integrated Coulomb counter for battery level monitoring and advanced security, including Silicon Labs’ Secure Vault with Virtual Security Engine (VSE) for secure boot and debug hardened against glitch attacks and tamper protection. It also offers shelf mode that reduces energy use to less than 20 nA so devices can stocked on the shelves and still maintain nearly full battery life.
The BB50 8-bit MCUs are designed for non-connected versions of connected devices, such as a simple control mechanism for ambient light or occupancy sensors in commercial lighting applications, or non-connected versions of toothbrushes for users who just want an electric toothbrush.
The new BB50 MCU and the larger BB5x MCU devices address challenges around inventory and number of SKUs with the non-connected versions of the product designed different from the connected version. It also can be used for devices like LED lighting, keypads, drones, toys and anything with flashing lights or a motor that require a processor to control those functions, regardless of whether it is connected for added functionality, said the company.
The 8-bit MCUs share common tools and software with Silicon Lab’s 32-bit devices, such as the company’s Simplicity Studio and a fully featured 8-bit compiler. Other features include wide operating voltage ranges, low-power modes for battery applications to improve energy efficiency, a variety of packaging options ranging from 2 mm-squared to 5 mm-squared and firmware examples that enable users to add functionality to an existing product with little or no additional firmware development, said Silicon Labs.
Silicon Labs is hosting several demos of its wireless technologies in Hall 4A, booth #s 128 and 129.
GPUs and RISC
Think Silicon is demonstrating its latest ultra-low-power graphics and AI solutions for edge computing devices in wearables, smart home, industrial and automotive applications.
Hosting the demos in Hall 4, Booth #476, a featured demo is the company’s RISC-V-based GPU, the NEOX IP series. Claimed as an industry first, the NEOX is touted as a “new era of smart GPU architectures with programmable compute shaders, running on a real-time operating system (RTOS) and supported by lightweight graphics and ML programming frameworks.” The GPU platform targets next-generation ultra-low-power smartwatches, augmented reality (AR) eyewear, surveillance and entertainment video and smart displays for point-of-sale/point-of-interaction terminals.
Also on display is the NEMA |pico VG, the latest in the NEMA |GPU-Series for MCU-driven SoCs. The NEMA |pico VG enables smartphone-like vector graphics for the MCU market and is suited for wearable and embedded-graphics display applications requiring high-quality fonts, shapes and maps. Along with the NEMA |pico VG hardware, Think Silicon offers the NEMA |vg, an extension to the NEMA |gfx-api that enables high-quality vector graphics rendering with exceptionally low (typically less than 5 percent) CPU utilization, which is up to 4× lower than its predecessor, according to the company. Available now, it comes with a suite of driver, API and software development tools.
Other products featured at the booth include the Ambiq Apollo4 Plus SoC Graphic Display Kit with the NEMA |pico XL with Vector Graphics and the NEMA |gui-builder, a graphical cross-platform software framework for GUI development on low-resource hardware. The Apollo4 Blue Plus targets IoT endpoint devices, including smartwatches, children’s watches, consumer medical devices and the smart home. The GUI builder offers drag-and-drop capabilities for faster creation of high-end 3D GUIs and fluent animations for size- and power-constrained display devices using NEMA |GPUs.
To accelerate RISC-V application software development, Imperas, MIPS and Ashling announced a new collaboration to support developers for advanced processor applications from SoC concept to deployment. The collaboration leverages the MIPS compute solution (eVocore P8700 RISC-V multiprocessor), Imperas reference models for the eVocore P8700 and Ashling RiscFree SDK tools.
Imperas, MIPS and Ashling RISC-V collaboration (Source: Imperas)
The Imperas reference models provide a programmer’s view of the MIPS eVocore P8700 running full application-class workloads and operating systems, while the Ashling tools provide the toolchain support including an IDE, compiler and software debugger. Key features include virtual platforms to help with multicore architectural exploration during the SoC concept stage, along with OS porting, driver development and applications-grade software development. Fixed platform kits can be used as virtual dev boards for end users of new SoC devices, said Imperas.
The MIPS eVocore CPUs are claimed as the first MIPS CPUs based on the RISC-V instruction set architecture (ISA) for high-performance heterogeneous computing. The eVocore P8700 Multiprocessor was nominated for the embedded award 2023: SoC/IC/IP design and is available now to lead partners. Visit MIPS and Imperas in the RISC-V Pavilion in Hall 4A, booth #620. Imperas also is presenting three papers on RISC-V at Embedded World. Ashling is exhibiting in Hall 4, booth #554.
Ashling also announced that Imagination Technologies will use the RiscFree SDK for software development support of its Catapult RISC-V-based IP cores. The RTXM-2200 is the first commercial, licensable CPU IP from the RISC-V Catapult family featuring a real-time, highly scalable, 32-bit embedded design.
Watch for more coverage on the latest advances in system-on-modules, system-in-package, single-board computers and design tools.
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Connected MCU enables secure NFC authentication
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Automotive MCU targets wireless applications
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