Electronic Products looks back at the top 10 products of 2023 and finds that 5G and IoT designs dominate when it comes to electronic components. This is followed by RF design and satellite connectivity.
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Over the past year, electronic component manufacturers have been making big investments in 5G as demand climbs for even higher-speed internet and communications for both consumers and enterprise customers. It also is driven by the need to analyze more data, faster and more efficiently. There is also growing interest in satellite connectivity.
So, what do 5G designers need? They require solutions that are smaller and highly integrated to simplify design and lower costs, but they also need to enable higher efficiency, lower power consumption and better thermal performance. Component manufacturers delivered on all fronts, from RF power modules to baseband processors.
Electronic components targeting wireless technology and IoT also earned some top views. These include IoT modules, platforms and combo chips. These devices also address challenges around design complexity, power consumption and size as well as deployment.
The top 10 products are based on the highest page views in 2023, solely looking at new product introductions launched during the year. Here are the top 10 most popular products.
Top-side cooled RF power modules shrink 5G radios
NXP has introduced top-side cooling packaging for RF power modules that enables smaller, thinner and lighter radios for 5G base stations.
Qualcomm unveils 5G Advanced modem-RF system
Qualcomm readies for the “next phase of 5G,” claiming the industry’s first 5G Advanced modem-RF system to drive new opportunities across key vertical markets.
U-blox claims smallest cellular & satellite IoT module
The u-blox SARA-S520M10L is the company’s first IoT module to integrate both cellular and satellite connectivity.
Qualcomm unveils Snapdragon Satellite
Pole-to-pole global coverage for two-way messaging via satellite and Android smartphones just took a giant leap with the launch of Qualcomm’s Snapdragon Satellite.
GaN Systems unveils 800-V OBC reference design
GaN Systems’ GaN-based 800-V OBC reference design delivers higher power density and lower bill-of-materials costs for EV automotive applications.
Qualcomm launches Aware Platform to simplify IoT
Qualcomm has announced the Aware IoT platform that combines its chips, tools and ecosystem to accelerate IoT deployments across multiple industries.
Marvell baseband processors advance 5G networks
Marvell has launched industry-first 5-nm baseband processors with enhanced performance and energy efficiency for 5G networks.
AMD rolls out 5G RF chips and test services
AMD unveiled its latest RF chips and EPYC processors for the 5G telco market and its new Telco Solutions testing lab at MWC.
Infineon MCUs support Rust programming language
Infineon is the first major semiconductor manufacturer to support the Rust programming language for its microcontrollers.
Wi-Fi + Bluetooth combo chip extends battery life
Infineon’s Wi-Fi + Bluetooth combo chip reduces power consumption by up to 65%, extending battery life in IoT applications.
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