Everspin expands industrial STT-MRAM family

Everspin Technologies has expanded its flagship STT-MRAM product family with the introduction of the EMxxLX devices. This new family targets electronic systems where data persistence and integrity, low power, low latency and security are critical. The expansion adds a 4-Mbit capacity, a smaller package and an extended temperature range.

(Source: Everspin Technologies)

The EMxxLX offers enhanced performance, endurance and retention in densities from 4-to-64 megabits (Mbits) with new and smaller packaging for 4-to-16 Mbit devices. The new 5 × 6-mm DFN package reduces area by 37% compared to the previous footprint. The extended operating temperature ranges from -40°C to 105°C.

The family replaces solutions such as SRAM, BBSRAM, FRAM, NVSRAM and NOR flash devices. Applications include industrial IoT, network enterprise infrastructure, process automation and control, aeronautics/avionics, medical, gaming and FPGA configuration.

The STT-MRAM technology features high-performance, multiple I/O and a high-speed, low-pin-count SPI-compatible bus interface with a clock frequency of up to 200 MHz. The MRAM devices operate on a 1.8-V power supply and deliver a read/write bandwidth of 400 MB/s using eight I/O signals.

Expanding the MRAM’s capabilities results in protecting critical system data under any condition including power loss. The EMxxLX product line features SRAM-like performance, low latency and the capability to maintain memory without requiring power. By adding a 4-Mbit capacity, the MRAM devices increase the options for optimal density solutions, combined with ease of integration, said the company.

Everspin is now sampling the 4-Mbit capacity with the smaller DFN package, with production planned for the first quarter of 2024. Production orders of the 8-Mbit to 64-Mbit capacity options with the extended temperature range are available.