By Nicole DiGiose, technical content editor
TE Connectivity recently unveiled its extra-large array (XLA) socket technology, which provides more reliable performance with 78% better warpage control than traditional molded socket technologies. The XLA socket technology allows enhanced sockets to support high data speeds in next-generation data centers.
Image source: TE Connectivity.
The utilization of printed circuit board (PCB) substrates versus other plastic materials results in minimal warpage, enabling TE to design the industry’s largest one-piece socket with sizes up to 110 x 110 mm and a 10,000+ position count capability. Due to such a large capacity, these sockets are capable of extremely fast data rates up to 56 Gbits/s.
Product features include:
- Socket housing facilitates efficient soldering to the PCB.
- Socket is supplied with a cap to facilitate vacuum pick-and-place.
- Backplates are available in zinc or nickel plating.
“TE’s XLA socket technology provides the ability to scale to extremely high pin counts, staying ahead of market demand for next-generation switches and servers,” said Erin Byrne, vice president, engineering director, and chief technical officer for Data & Devices at TE Connectivity, in a statement. “The XLA socket will enable the expansion in scale and performance needed for future high-performance computing and processing.”
Other benefits cited include 33% improved true position on the solder ball and contact, low coefficient of thermal expansion (CTE) mismatch to motherboard, and mitigation of SMT risks during customer application. Two versions are available: the hybrid land grid array/ball grid array (LGA/BGA) and the dual compression LGA/BGA.
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