Fairchild Semiconductor Introduces the Industry's Smallest DrMOS FET Plus Driver Multi-Chip Module for Synchronous Buck Converters
Fairchild Semiconductor (NYSE: FCS) announces the FDMF6700, a fully optimized and integrated FET plus driver power stage solution in an ultra-compact 6mm x 6mm MLP package. The FDMF6700 offers designers a compelling solution for severely space-constrained applications such as small-form-factor desktops, media center PCs, ultra-dense servers, blade servers, advanced gaming systems, graphic cards, networking and telecom equipment, and other DC-DC applications with limited board space.
The FDMF6700 in Fairchild's new 6mm x 6mm MLP power package saves more than 80 percent board space compared to conventional discrete solutions
A typical buck converter in a PC motherboard may include, per phase: three N-channel MOSFETs in a DPAK package and one driver IC in SO8 package. By replacing these components with the new highly integrated FDMF6700, designers save more than 80 percent of valuable board space.
In addition, through the integration of components into an optimized single-package solution, parasitic inductances of board traces and leads of the individual discrete packages are eliminated, improving overall efficiency.