Fairchild Semiconductor’s Family of UltraFET Devices in MLP 3×3 Offers Industry-Leading Switching/Thermal Performance for DC/DC Converter Designs

Fairchild Semiconductor's Family of UltraFET Devices in MLP 3×3 Offers Industry-Leading Switching/Thermal Performance for DC/DC Converter Designs

Expanding its broad portfolio of power switch solutions, Fairchild Semiconductor (NYSE: FCS) announces new 100V, 200V and 220V N-channel UltraFET devices available in ultra-compact (3mm x 3mm) molded leadless packages (MLP). These devices are ideal for primary-side switches in isolated DC/DC converter applications, such as work stations, telecom and networking equipment, where improving system efficiency and saving board space are mandatory design goals.

New 200V N-channel device offers best-in-class FOM and thermal resistance

Fairchild’s 200V device, the FDMC2610, boasts the industry’s lowest Miller charge (3.6nC vs. 4nC) and the lowest on-resistance (200mOhms vs. 240mOhms) when compared with similar 200V MLP 3×3 devices on the market. These characteristics result in a 27 percent better Figure of Merit (FOM) and translate into superior thermal and switching performance in DC/DC converter applications.

The 200V device also offers best-in-class thermal resistance (Theta JC) compared with similarly packaged devices (3C/W vs. 25C/W), a heat-dissipating feature that ensures reliability even in demanding environments.