CN-1736 is a reworkable underfill designed for use with 0.4-mm-pitch package-on-package (POP) assemblies. With low viscosity, lower coefficient of thermal expansion (CTE) than previously, and greater flux compatibility, it is suitable for use with a broad range of solder pastes and tacky fluxes.
The CN-1736 has a viscosity of 650 cm/s, compared with 900 cm/s in previous products. Given that fine-pitch solder joints are fragile and susceptible to underfill-induced thermal cycle failure, the CN-1736 features aCTE of 55 ppm/°C, compared to 64-75 ppm/°C for its predecessors. (Contact company for price and availability.)
By Carolyn Mathas
Zymet , East Hanover , NJ
Information 973-428-5245
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