First molded CSP device reduces height 50%

The AOC2403 is the industry’s first molded chip scale package (MCSP) in a 0.97 x 0.97 x 0.3-mm package. It reduces package height by 50% compared to typical CSPs and improves the mechanical robustness of the package by protecting the encapsulated die with a layer of molding compound. The device suits the latest ultra-portable applications including smart phones, tablet PCs, UltraBooks and other mobile hand-held devices.

The MCSP replaces a standard CSP by offering the same footprint, pin-out, and pitch, with the benefits of a more rugged and ultra-thin package. It encapsulates the MOSFET silicon in a halogen-free molding compound that provides it with a thinner and more robust structure to solve die chipping and placement issues associated with standard CSP products. The device is a 20–V 95–mΩ p-channel MOSFET that measures 0.97 x 0.97 x 0.3–mm. ($0.35 ea/1,000 — available now.)

By Paul O’Shea

Alpha & Omega Semiconductor , Sunnyvale , CA , United States
information 408-830-9742
http://www.aosmd.com