Flip-chip pack doubles density, reliability

Designed to reduce costs, the CoreEZ flip-chip package uses organic thin-core technology to offer up to twice the number of signal layers and twice the board-level reliability of flip-chip ceramic or plastic BGAs.

The core’s 199-µm-pitch vias, smaller pads (permitting pad pitches down to 150 µm), and 50-µm-diameter laser-drilled holes allow strip-line signal layers on both core sides. The package uses particle-filled standard epoxy without glass to produce a thin core that also improves power distribution and dissipation. (Contact Theresa Taro for pricing and availability.)

Endicott Interconnect Technologies Endicott , NY
Theresa Taro 866-820-4820

http://www.eitny.com