Thinner than a credit card, the ThinSink is said to be the thinnest forced-convection (fan-cooled) heat sink. It has a volumetric cooling efficiency 25 times greater than today’s best microprocessor heat sinks, and cools 25 times more heat per cubic centimeter.
The fan-cooled heat sink fits inside small electronic devices such as notebooks, monitors, and tablets, and cools ICs, semiconductors, LEDs, and other microelectronic heat-generating devices. The product technology can be fabricated in almost any shape or size, and be incorporated within existing structures such as circuit boards or enclosures. The fan and motor rotates a thin toroid (circular fan disc) that generates an axial-to-radial fluid flow field across a heat sink. The local radial velocity near toroid’s perimeter is about 12.6 m/s. The volumetric cooling efficiency is 0.081 W/°C/cc. The device consumes only 0.031 W of electricity and produces a sound level of 34 dBA. (Contact
or 702-363-8443 for price and availability.)
By Paul O’Shea
Novell Concepts , Las Vegas , NV
Information 702-363-8443
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