Free Webinar: Engineering Design Guide for Heat Sinks and Heat Pipes

This Webinar, sponsored by Innovation in Action, provides engineers with tools for effective design of heat sinks and heat pipes. It provides important guidelines for the two primary areas of air cooled heat sink design: total volume and fin design.

Our experts introduce easy ways to size your heat sink to meet your temperature rise goals and explore key design aspects used to generate ideal thickness and pitch of external fins in order to maximize heat rejection.

Viewers will be provided with a complete guide to designing, modeling, and implementing heat pipes into your heat sink. After completion, engineers will be able to design a more effective heat sink for high power or space-limited applications.

For more information and to register, visit http://video.webcasts.com/events/pmny001/viewer/index.jsp?eventid=47360

  
Speakers:

 Bryan Muzyka , Sales Manager, Electronics Products Group

Bryan graduated with a B.S. in Mechanical Engineering from Penn State University. He worked as Research and Development Engineer for ACT's Aerospace Group before taking on a business development role. Bryan is currently Sales Manager for ACT's Electronics Products Group responsible for military and aerospace products. Bryan has firsthand experience designing, analyzing, and integrating heat pipes into real-world applications.

Scott Garner , Vice President, Electronics Products Advanced Cooling Technologies, Inc. 

Mr. Garner is VP and Manager of the EP group. He has twenty years’ experience in the field of heat transfer and thermal management. His experience includes both engineering and management in technology development, product development and sales and marketing. He is an inventor on 14 patents and has written a variety of technical publications and chaired and co-chaired numerous sessions on thermal management for a variety of professional conferences. His expertise is in working with customers to integrate heat pipes and two phase heat transfer systems into electronics cooling systems.

Note: Registration information will be shared with sponsor.