Freescale launches single-chip ZigBee® Platform in Package™ solution

Freescale launches single-chip ZigBee® Platform in Package™ solution

Freescale Semiconductor has introduced a single-chip platform solution based on the ZigBee® specification that is designed to deliver the industry's lowest power consumption and highest performance. The MC1322x platform is engineered to support battery life of up to 20 years, doubling the expectations for current ZigBee solutions.

Ultra-low-power wireless platform designed to enable up to 20-year battery life; features up to 2 Mbps TurboLinkâ„¢ technology performance

Freescale's MC1322x is available in a Platform in Package™(PiP) solution that integrates the essential components of a ZigBee application within a single package, thereby reducing component count and system cost. The MC1322x platform contains a 32-bit microcontroller (MCU), a fully compliant IEEE® 802.15.4 transceiver, balun and RF matching components-all integrated into a small-footprint land-grid array (LGA) package that virtually eliminates the need for external RF components. The platform solution also features a TurboLink™ technology mode, engineered to increase data rates by up to 2 megabits per second between nodes.