Freescale unveils next-generation device in single-chip IEEE 802.15.4/ZigBee® Platform-in-Package family

Freescale unveils next-generation device in single-chip IEEE 802.15.4/ZigBee® Platform-in-Package family

MC13224 device eases development of a wide range of wireless industrial and home entertainment applications

ORLANDO (Freescale Technology Forum) – June 17, 2008 – Freescale Semiconductor is now sampling the next-generation MC13224 device in its single-chip IEEE 802.15.4/ZigBee® Platform-in-PackageTM (PiP) family. This family is based on IEEE 802.15.4 technology, known for its benefits in the areas of cost, performance and efficiency for real-time remote monitoring and control.

The latest addition to the MC1322x family is designed for a range of wireless applications, including energy management, commercial building automation, industrial control and monitoring and home entertainment control. The family supports existing protocols, such as SMAC, IEEE 802.15.4 MAC, ZigBee stack and SynkroTM network protocol stack, with the ability to support the WirelessHARTTM specification, ISA100 and 6LoWPAN.

The MC13224 device is based on the IEEE 802.15.4 specification and designed to provide a highly integrated, total solution with premier processing capabilities and very low power consumption. Freescale has done this by integrating the essential components of an IEEE 802.15.4 based application within a single package, requiring designers to add only an antenna and crystal.

The MC13224 contains a 32-bit ARM7 microcontroller (MCU), a fully compliant IEEE 802.15.4 transceiver, flash, RAM and ROM, high-performance peripherals, balun and RF matching components. This is all integrated into a small-footprint land-grid array (LGA) package that virtually eliminates the need for external RF matching components, making it easy for designers to get up and running quickly and ultimately decreasing time- to-market and overall system cost.

“The MC13224 device is a very powerful solution for ZigBee and ZigBee PRO applications,” said Heino Kähler, development manager for Wireless Modules at Panasonic Electronic Devices Europe GmbH. “We have selected it for our next generation module family PAN456x, a flexible, turnkey module that accelerates the development of ZigBee-compliant applications. PAN456x engineering samples with the MC13224 device will be available in August this year.”