Functional testing of 0.3mm pitch Wafer Level Packages to Multi-GHz Speed made possible by Innovative Socket Technology

Today’s electronic packages have high clock speeds (multi GHz range), fine pin densities (below 0.4 mm pitch) and high pin counts (over 1000). When these packages assembled onto a printed circuit board (PCB), they perform certain functions at certain speed. Socketing is one of the avenues to test the functionality of IC packages without damaging it. Socketing these high-speed and high-density IC packages requires an innovative solution to the challenges of designing a shorter signal path (less resistance), good electrical insulation (prevents signal loss), and proper thermal management. Design of the socket is dictated not only by the functions mentioned above, but also by the other parameters such as durability, power consumption, assembly methods and the environment in which the system will operate. Silver ball Matrix (SM) GHz socket (Figure 1) provides a solution that is fast, dense and durable.