Grounding spring works for mobile devices

With a patented, robust structure and a wide working range, FCN-118X series grounding springs are designed to provide grounding between a pc board and chassis for smartphones, tablet PCs, PDAs, and other small mobile devices. The component has a 1.4 x 3.7-mm footprint and a unique side-wing structure that increases the spring’s rigidity and strength so as to resist deformation by outside forces. 

The spring may also be used as a 4-A-power contact between pc boards. Specifications include a 2.05-mm initial height, a 0.80-mm displacement, a 1.25 to 1.80-mm working range, and a contact force of 0.5 to 1.6 N. Contact resistance is 40 mΩ at 20 mVdc and 1 mA.