CUI’s Thermal Management Group has added a heat sink product line to its existing portfolio of Peltier devices and DC fans. The new aluminum heat sinks — available in both extruded and stamped versions — are designed to improve the heat dissipation of low- and high-power board-level applications.
The stampings and extrusions are conveniently measured under four conditions for thermal resistance, making it easier to select the optimal heat sink for natural convection or forced air cooling systems. CUI’s new heat sinks are compatible with TO 218, TO 220, TO 252, and TO 263 transistor packages.
The extruded and stamped heat sinks come in tin-plated or black-anodized material finishes and are available with or without solder pins in vertical or horizontal orientations. Thermal resistances measured at 75°C ΔT in natural convection environments are as low as 4.49°C/W, while power dissipation ratings measure up to 16.7 W at 75°C ΔT in natural convection.
CUI offers a range of custom heat sink capabilities along with standard form factors and sizes. The manufacturer claims that it can create virtually any shape or profile to fit specific design needs by using the choice between extrusions and stampings as well as alternate production methods such as forging and die casting.
CUI also makes available additional materials and finishes, including clear and color anodization, chromate powder coating, and nickel or zinc plating. Hole-punching for custom mounting patterns is also an option.
Moreover, CUI’s standard or custom heat sinks can be integrated with any of its current Peltier and DC fan offerings to assemble more complex thermal solutions.
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