Heat sinks cool 17-mm2 BGAs
The ATS-590 and ATS-619 heat sinks cool 17 x 17-mm BGA packages, such as Intel 82571EB Gigabit Ethernet controllers and Xilinx Virtex-4 devices. Both RoHS-compliant sinks maintain Tcase at or below the manufacturer’s specifications.
The 9.5 x 25 x 25-mm ATS-590 has an 8.42°C/W thermal resistance and a pair of spring-loaded push-pin mounts. The 16.25 x 22 x 24-mm ATS-619 has a 6.11°C/W thermal resistance and its attachment system consists of a plastic snap-on chip-surround frame and a spring clip that fastens the sink to the frame. (Ea/large qty: ATS-590, less than $7; ATS-619, less than $14—available now.)
Advanced Thermal Solutions , Norwood , MA
Ray Santos 781-769-2800
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