The AER, APF, APR, and BDN series of heat sinks suit BGA, PGA, PLCC, QFP and other IC packages. The AER, APF, and APR forged, low-profile thin-fin heat sinks offer height ranges from 6.3 to 32.6-mm with thermal resistance of 1.9°C/W with 200 lfm convection. These heat sinks require no special tools to assemble on the IC packages or additional holes on the PCB. They suit large ICs with heat dissipation needs.
The BDN extruded heat sinks have a pre-applied adhesive tape that peels off and sticks onto the component. The adhesive shear strength at 100°C is 36 psi so, a one-inch square heat sink would require a 36-lb force to remove heat sink. Thermal resistance for this product is as low as 2.6°C/W at 400-lfm forced convection flow conditions.
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