High-density connector links SOMs with carrier boards, development kits

The Jetson TX1 and Jetson TX2 systems-on-module (SOMs) from Nvidia are using Samtec’s high-density connector on the back of the SOM for mating to development kits and application-specific carrier cards.

Both SOMs leverage an 8×50 SEARAY Terminal that mates with an 8×50 SEARAY Socket on the carrier card. The SEARAY high-density open-pin field arrays boast interconnect features that make them a suitable option for high-speed mezzanine applications.

Samtec’s SEARAY — operating on a 1.27 x 1.27-mm grid — provides designers the ability to simultaneously run differential pairs, single-ended signals, and power through the same interconnect. And its open-pin field design ensures maximum grounding and in-system routing flexibility.

SEARAY also features Samtec’s patented Edge Rate contact system; it’s a rugged contact designed for high-speed applications such as Nvidia’s Jetson platforms. The contacts are positioned in the plastic body to minimize broadside coupling and crosstalk.

Edge Rate contacts mate on the smooth milled surface of the contact, and that facilitates higher cycle life and superior electrical properties. The contact design also lowers insertion and extraction forces while enabling “zippering” when mating and unmating the connectors.

Nvidia’s Jetson TX1 module includes the latest technology for deep learning, computer vision, and graphics applications. And Nvidia’s Jetson TX2 module features a variety of standard hardware interfaces for easy integration into intelligent edge devices like robots, drones, smart cameras, and portable medical appliances.