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High performance bonding epoxy resin system

Master Bond- High performance bonding epoxy resin system
The EP21ARHT is a two-component epoxy adhesive, sealant, coating, and encapsulation system featuring high bond strength, and exceptional chemical resistance to acids.

The EP21ARHT has convenient 100 to 50-mix ration by weight and is formulated to cure at ambient temperature or more quickly at elevated temperatures. It has exceptional resistance to a wide array of chemicals, particularly to acids (a more detailed list appears below). It is especially noteworthy for its resistance to sulfuric and hydrochloric acids.

EP21ARHT is 100% reactive and contains no solvents or diluents. It has very low linear shrinkage upon cure. Also, it has outstanding physical properties and electrical insulation values. EP21ARHT can be used as an adhesive, sealant, coating, potting or encapsulating material. EP21ARHT is especially useful for coating tanks and other vessels that may contain acids. It is serviceable over the wide temperature range of -60°F to +400°F. It adheres well to a wide variety of substrates including metals, glass, ceramics and many rubbers and plastics. The standard version of this system has a lower viscosity with good flow. A non-drip version called EP21ARHTND is also available. Part A is clear and Part B is amber clear. This epoxy compound is widely used in aerospace, electronic, electrical, chemical processing applications and in other applications where chemical resistance to acids is needed.

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