Hybrid FPC-to-board connector saves space in mobile device designs

Hirose has introduced a high-power hybrid FPC-to-board connector that reduces the PCB mounting space by up to 40%. Designed for mobile devices with built-in battery or USB connections, the BM50 Series also delivers flexibility by using a FPC to connect the USB to the board. This enables the USB to be placed anywhere in the design, said Hirose.

The 15-A FPC-to-board connector features a multi-point dimpled contact design for both the power (4-point) and signal (2-point) contacts. This helps ensure higher reliability and long operation life.

Using two mounting points per contact, the BM50 connector design also shortens the length of electricity flow to minimize heat generation when a high current is used, said Hirose. This board mounting design is said to suppress heat generation to 30°C or less, even when 15 A is applied. The minimized contact resistance allows up to 100 W of power to be delivered via USB for fast charging.

The BM50 is designed for robustness with both ends of the housing covered with metal, which reduces the risk of housing damage from misalignment when mating. The connector also features a wide self-alignment range of ±0.24 mm in the pitch direction and ±0.2 mm in the width direction, along with guidance ribs. In addition, a multi-point metal lock prevents unintended unmating due to impact.

The BM50 features a height of 0.6 mm and a depth of 2.0 mm when mated. This makes it suited for mobile device applications such as smartphones and wearable devices.