IDT Announces Support for Dual-Core Intel® Xeon®-Based Platforms

IDT Announces Support for Dual-Core Intel® Xeon®-Based Platforms

IDT™ has announced its support for the new Intel® Dual-Core Xeon® Processor Series 5000 and 5100 (formerly codenamed “Dempsey” and “Woodcrest”). IDT is providing a suite of platform-optimized devices consisting of an industry-leading advanced memory buffer (AMB) device and a newly available portfolio of high-precision clocking components. With these products, IDT can support the critical timing and interface requirements of the new Intel server platforms.

Leading Semiconductor Solutions Provider Leverages Expertise in Timing Technology to Deliver Advanced Memory Buffer and High-Precision Clocking Devices Optimized for New Server Platforms

AMB devices are an essential building block for next-generation, high-bandwidth applications, such as servers, which require increased performance and large memory capacities. A key attribute of the fully-buffered DIMM (FB-DIMM) channel architecture is the high-speed, serial, point-to-point connection between the memory controller and modules on the channel. The AMB chip, located on each FB-DIMM, collects and distributes the data from or to a DIMM, buffers the data internally on the chip and receives or forwards it to the next DIMM or memory controller. This unique channel structure alleviates buffer latency issues common in registered DIMM technology, enabling designers to use a large number of DIMMs within a single system.<_o3a_p>

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