To meet growing demand for further downsizing and integration, Infineon Technologies AG has launched the 4.5-kV XHP 3 IGBT modules, targeting large conveyor belts, pumps, high-speed trains, locomotives, as well as commercial, construction and agricultural vehicles (CAV). The XHP family is comprised of a 450-A dual IGBT module with TRENCHSTOP IGBT4 and an emitter-controlled diode, and a 450-A double diode module with an emitter-controlled E4 diode.
The company said the new IGBT modules “will fundamentally change the landscape for medium voltage drives (MVD) and transportation applications operating at 2,000 to 3,300 V AC in 2- and 3-level topologies.”
(Source: Infineon Technologies AG)
Both modules offer improved isolation of 10.4 kV and help simplify paralleling and downsizing without sacrificing efficiency, Infineon said. “Previously, complex busbars were required to parallelize switching modules, resulting in complicated design efforts and leakage inductance.”
The new XHP family design simplifies paralleling by placing the connections side by side, resulting in the need for only a single straight busbar for paralleling.
The 4.5-kV XHP modules also reduce the number of units needed for a design. Application requirements can be reduced to two dual switches and a smaller double diode from designs that traditionally require multiple single switches and a double diode.
The combination of the XHP 3 FF450R45T3E4_B5 dual switch and the DD450S45T3E4_B5 double diode also deliver a smaller footprint and lower cost. Infineon’s previous IGBT solutions required four 140 × 190 mm² or 140 × 130 mm² switches and one 140 × 130 mm² double diode. With the new XHP family, the solution can be reduced to two 140 × 100 mm² dual switches and a 140 × 100 mm² double diode. Both modules are available now.
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