Mezzanine connector targets servers
Hirose has introduced a stackable BGA mezzanine connector that handles high-speed data transmission up to 112 Gbits/s for telecom and networking...
Communications
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SiC power simulator tests devices in design phase
Microchip’s MPLAB SiC Power Simulator rapidly evaluates its SiC power devices and modules before the hardware...
APEC 2023 underscores advances in power devices
Power device manufacturers roll out their latest advances that improve efficiency and system complexity while reducing package size and...
100G VCSEL and PD arrays target 800G transceivers
Coherent’s 100G PAM4 VCSEL and PD arrays target 800G transceivers and active optical cables, providing lower energy consumption per...
Securing IoT devices in the smart-city era
Smart cities rely on a range of security measures, from encryption and monitoring to incident-response planning and awareness...
Connected MCU enables secure NFC authentication
NXP’s single-chip connected MCU combines an NFC reader, a customizable MCU and a complete security...
