Top 10 switches and relays
Switch and relay manufacturers are delivering more options to help designers select the right device for their...
Communications
LATEST ARTICLES
PCIM Europe: More advances for GaN and SiC power semiconductors
Power electronics manufacturers showcased their latest GaN and SiC power semiconductors at PCIM Europe, touting big claims in power density and...
MDmesh MOSFETs deliver higher power density
STMicroelectronics has introduced its STPOWER MDmesh M9 and DM9 N-channel super-junction silicon power MOSFETs for...
Onsemi claims first TOLL-packaged 650-V SiC MOSFET
Onsemi’s TOLL-packaged 650-V SiC MOSFET offers a 60% smaller footprint compared with the standard D2PAK 7-lead...
GaN FET packs high power density in a small package
EPC’s 100-V, 2.2 mΩ EPC2071 GaN FET in a 10.2 mm2 footprint offers high power density and high efficiency for space-constrained...
Survey: Design cycles are getting faster
Molex’s survey of design engineers reveals that design cycles are getting faster, resulting in bigger engineering teams with more diverse...
