SiC and GaN power ICs rule at APEC 2024
APEC highlighted new developments in SiC and GaN power ICs and their promise for higher energy efficiency and power density in smaller...
Communications
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Integrated GaN HEMT ICs save board space
Innoscience’s family of 700-V integrated GaN HEMT ICs reduce component count and design...
CoolSiC MOSFETs target hi-rel applications
Infineon’s 750-V G1 CoolSiC MOSFETs address requirements for higher efficiency and power density in industrial and automotive power...
Nexperia expands MOSFET families
Nexperia announced two MOSFET product line expansions at APEC 2024, including space-saving ASFETs for PoE and 40-V NextPowerS3...
2024 outlook: Positioning, navigation and timing
Advancements in AI, edge computing and LEO satellites are shaping positioning, navigation and timing opportunities in...
Collaboration delivers AI-as-a-service platform
The combination of Supermicro’s Nvidia MGX-based servers and Vapor IO’s 5G- and AI-as-a-Service brings AI and 5G to the intelligent...
