LATEST ARTICLES

UWB-BLE module meets FiRa standard

Insight SiP’s ISP3080 UWB-BLE module improves power consumption and interoperability for FiRa-compatible chipsets and UWB mobile...

Nordic’s nRF54H20 highly integrated multiprotocol SoC can be optimized for either processing efficiency or...

The Molex MX60 Series of contactless connectivity solutions replace traditional DisplayPort, GbE and USB SuperSpeed connectors for higher...

Renesas customers can now share data between embedded and AI/ML projects for faster edge and endpoint AI application development in IoT...

The TDK sample kit features 10 different ultra-compact TVS diodes for general-purpose and high-speed ULC...

TDK offers a new haptics development starter kit to help speed up prototyping using its PowerHap piezo...