Industry's First Smart Power Module for Switched Reluctance Motors (SRM) Reduces Power Circuit Space by 40%
The FCAS50SN60 integrates one high-voltage IC (HVIC) and low-voltage IC (LVIC), IGBTs, fast recovery diodes and a thermistor into one Smart Power Module (SPM™). This device comes in an ultra-compact (44 mm X 26.8 mm) Mini-DIP package featuring Direct Bonding Copper (DBC) technology that significantly increases thermal performance.
The FCAS50SN60 integrates one high-voltage IC (HVIC) and low-voltage IC (LVIC), IGBTs, fast recovery diodes and a thermistor into one Smart Power Module (SPM™). This device comes in an ultra-compact (44 mm X 26.8 mm) Mini-DIP package featuring Direct Bonding Copper (DBC) technology that significantly increases thermal performance. The FCAS50SN60 not only reduces power circuit space by up to 40% compared to typically used discrete solutions, it also enables designers to incorporate the controller into the SRM assembly. This module greatly reduces overall system size while simultaneously enhancing reliability.