Infineon Technologies AG has launched its next-generation of XENSIV MEMS microphones with improved performance. The new IM69D127, IM73A135, and IM72D128 microphones with selectable power modes are suited for a variety of consumer electronics such as headphones with active noise cancellation (ANC), TWS earbuds, conference devices with beamforming capability, laptops, tablets, or smart speakers with voice-user interfaces. They also can be used in select industrial applications such as predictive maintenance and security.
(Source: Infineon Technologies)
The analog microphone IM73A135 claims best-in-class signal-to-noise ratio (SNR) of 73 dB(A) and an excellent acoustic overload point (AOP) of 135 dB SPL (sound pressure level). In comparison, the digital counterpart, the IM72D128, offers an SNR of 72 dB(A) and an AOP of 128 dB SPL. Both devices are housed in a 4 × 3-mm package.
The IM69D127 features similar performance with a SNR of 69 dB(A), but in a smaller 3.60 × 2.50-mm package.
The microphones are based on Infineon’s latest Sealed Dual Membrane (SDM) MEMS technology, which delivers high ingress protection (IP57) at a microphone level. The sealed MEMS design prevents water or dust from entering between membrane and backplate, said Infineon, avoiding mechanical blockage or electric leakage, which are common issues in MEMS microphones.
In addition, the microphones, with the SDM technology, can be used to create IP68 devices with the highest protection class, requiring only minimal mesh protection, said Infineon. Other features include “extremely” low distortions (THD) even at high sound pressure levels, very tight part-to-part phase and sensitivity matching, as well as a flat frequency response with a low frequency roll-off, an ultra-low group delay, and selectable power modes.
The XENSIV MEMS microphones can be ordered now. The devices are RoHS compliant and halogen-free.
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