By Heather Hamilton, contributing writer
Innodisk , a provider of flash memory, DRAM modules, and embedded peripheral products in industrial and enterprise applications, recently announced the release of a ruggedized DDR4 2666 wide-temperature DRAM series. All modules operate over the temperature range of −40°C to 85°C and surpass JEDEC standards.
The DRAM series targets the tough conditions of edge-computing devices and comes in unbuffered (with ECC or without) and buffered modules. The series uses original ICs and is equipped with anti-sulfuration capabilities. They’re also compatible with the Intel Mehlow and Purley server platforms and Coffee Lake desktop PC CPUs.
“DDR4 2666 will eventually become the standard specification on the market,” said Samson Chang, Innodisk Global VP of DRAM, in a press release. “With this move, we have already secured a good position to supply the current and future IoT and edge-computing demands for industrial-grade, high-performance DRAM modules.”
The series of wide-temperature DRAM can be purchased now in a range of capacities, from 4 GB to 16 GB, and is suited for a variety of industrial and mission-critical applications. These include rugged servers, fanless systems, surveillance, and networking applications. The company said that as the industry shifts toward edge computing, the need for memory with wide-temperature capabilities increases, particularly for aerospace and in-vehicle applications.
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