Inside the World’s First 4G Phone — the HTC EVO 4G Smart Phone

Inside the World’s First 4G Phone — the HTC EVO 4G Smart Phone

Ottawa, Ontario, June 7, 2010 – Chipworks (www.chipworks.com), the world’s leader in reverse engineering and patent infringement analysis for semiconductors and microelectronic systems, has done a silicon level teardown of the world’s first 4G phone, the HTC EVO 4G. For complete details and links to in-depth reports, visit http://www.chipworks.com//HTC-EVO-Teardown.aspx. A snapshot of the findings follows.

Qualcomm has three major socket winners on the board including:

• Qualcomm QSD8650 Snapdragon

• Qualcomm RTR6500 CDMA2000 transceiver

• Qualcomm PM7540 power management IC

Texas Instruments racks-up two more design wins with a leading-edge 3.5 G or greater phone:

• The TPS65051 6-channel power management IC with 2 DC/DCs, 4 LDOs, in 4x4mm QFN is the second TI PMIC

• TI65200 Power Management IC for digital cameras

Sequans Communications is showing its strength in the market:

• Sequans Communications 65 nm SQ1210 Wimax single chip solution that delivers baseband and Triple-band RF: 2.3-2.4, 2.5-2.7, 3.3-3.8 GHz operability — this device debuts in the world’s first 4G phone; Chipworks is working on a complete Functional Analysis Report

Atmel scores another touch screen controller win:

• The Atmel MXT224, part of the maXTouch family of touch screen controllers

Two design wins for OmniVision:

• OmniVision OV8812 8 Mp image sensor (suspected from die analysis but this superficial analysis is insufficient to 100% confirm that it is not the OV8810)

• OmniVision OV261 1.3 Mp image sensor

www.chipworks.com//HTC-EVO-Teardown.aspx