Intel and Micron Develop the World’s Fastest NAND Flash Memory

Intel and Micron Develop the World’s Fastest NAND Flash Memory

New High Speed NAND Technology Targeted at Computing, Video, Photography and Other Consumer Applications

Intel Corporation and Micron Technology Inc. today unveiled a high speed NAND flash memory technology that can greatly enhance the access and transfer of data in devices that use silicon for storage. The new technology – developed jointly by Intel and Micron and manufactured by the companies’ NAND flash joint venture, IM Flash Technologies (IMFT) – is five times faster than conventional NAND, allowing data to be transferred in a fraction of the time for computing, video, photography and other computing applications.

The new high speed NAND can reach speeds up to 200 megabytes per second (MB/s) for reading data and 100 MB/s for writing data, achieved by leveraging the new ONFI 2.0 specification and a four-plane architecture with higher clock speeds. In comparison, conventional single level cell NAND is limited to 40 MB/s for reading data and less than 20 MB/s for writing data.

“Micron looks forward to unlocking the possibilities with high speed NAND,” said Frankie Roohparvar, Micron vice president of NAND development. “We are working with an ecosystem of key enablers and partners to build and optimize corresponding system technologies that take advantage of its improved performance capabilities. Micron is committed to NAND innovation and designing new features into the technology that create a powerful data storage solution for today’s most popular consumer electronic and computing devices.”

“The computing market is embracing NAND-based solutions to accelerate system performance through the use of caching and solid-state drives,” said Pete Hazen, director of marketing, Intel NAND Products Group. “At up to five times the performance over conventional NAND, the high speed NAND from Intel and Micron, based on the ONFi 2.0 industry standard, will enable new embedded solutions and removable solutions that take advantage of high–performance system interfaces, including PCIe and upcoming standards such as USB 3.0.”

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