Interconnect system boosts data speed, signal integrity

Molex has added to its zSFP+ interconnect system the ability to utilize channels with individual lane data rates of up to 56 Gbps to cater to high-density Ethernet and Fibre Channel applications. The upgraded interconnect system supports PAM-4 channels in a stacked 2×N port configuration.

While taking the speed to a new level, the upgraded system still maintains a low insertion loss and crosstalk as well as thermal and electromagnetic interference (EMI) containment that users are accustomed to from the previous zSFP+ system.

Molex claims to provide a passively cooled solution by using an enhanced airflow cage design. That maximizes airflow through the cage, so the connector is able to lower the temperatures by about 17°C. “This yields optimal thermal management for next-generation systems while eliminating the need for costly heatsinks or cooling modules,” said Chris Hagerman, global product manager at Molex.

The 56-Gbps PAM-4 channel interconnect system includes EMI ganged cages, which are available in multiple port sizes from 2×1 through 2×12. They create flexibility in the PCB signal routing of LEDs.

Molex also offers terminal and wafer on the stacked integrated connectors in the zSFP+ interconnect system. The terminal ensures superior signal integrity for 56-Gbps PAM-4 applications. Moreover, the system allows users to merge standard cables and modules at greater data speeds.