Interface materials reduce board damage

Manufactured with a unique hardened-top surface, the Sarcon GR-H and XR-H thermal interface materials for gap pads can reduce damage to board materials during disassembly. The one-sided surface treatment is less tacky than the opposing contact side, which allows thermal pads to consistently adhere to either the electrical component or opposing heat sink.

Available in eight different formulations, the gap filler materials offer thermal conductivity from 1.2 to 17.0 W/m°K. The gap fillers are available in 0.5 to 5.0 mm-thick sheets and up to a maximum 200 x 300 mm. (Contact company for pricing and availability.)

Fujipoly America , Carteret , NJ
Information 732-969-0100

http://www.fujipoly.com