Introducing New High-Current, High-Density Interconnect Systems

Introducing New High-Current, High-Density Interconnect Systems

Discover the power and flexibility of Mini-Fit Plus HCS™ and Mini-Fit RTC™

Sponsored by Molex

Mini-Fit Plus HCS™

Mini-Fit RTC™

As the latest additions to the Molex Mini-Fit® product line, our new high-current, high-density connectors are ideal for telecom, medical, industrial, computer and power supply applications.The Mini-Fit Plus HCS (High-Current System) includes crimp terminals, headers and receptacles that increase current power loads to up to 13A per circuit. In addition, this product will allow for increased mating cycles. Plus, their patented design expands wipe lengths and contact areas without changing the connector footprint. Our Mini-Fit RTC Reflow Temperature Compatible headers feature a special housing made of LCP that can withstand solder-reflow temperatures of up to 265º C. Learn how these systems can enhance your designs now.

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