Jungo Expands USB Collaboration with Synopsys to Include Software Support for SuperSpeed USB 3.0

Jungo Expands USB Collaboration with Synopsys to Include Software Support for SuperSpeed USB 3.0

Highlights:

Jungo’s USBware embedded SuperSpeed USB 3.0 software stacks will be built for and tested with the Synopsys DesignWare SuperSpeed USB host and device IP

USB 3.0 is up to 10 times faster than USB 2.0

Jungo-Synopsys solution enables large video files to be transferred in a matter of seconds

USBware for USB 3.0 includes compliant Mass Storage UASP Class Driver and xHCI controller support

SAN JOSE USA, April 22, 2009 – Jungo Ltd., a leading provider of connectivity software solutions, today announced that its USBware for SuperSpeed USB 3.0 stacks will be integrated with the Synopsys DesignWare SuperSpeed USB IP offering. The result is a complete turnkey solution for silicon manufacturers.

Jungo and Synopsys have a long history of working together, resulting in the successful deployment of Jungo’s USBware and Synopsys’ DesignWare USB 2.0 IP cores on industry leading embedded CPU architectures such as Samsung S3C241x, Freescale MPC8270, ST40, ARM9, SPARC, PNX 8310/833x and others. Jungo and Synopsys now extend the success of this collaboration to accelerate the adoption of SuperSpeed USB 3.0 designs.

USB 3.0, also known as SuperSpeed USB, is the new standard USB protocol. Completed in late 2008, it features several improvements compared to the “High Speed” USB 2.0 protocol. These include bandwidth of up to 5.0 Gb/s (compared to 480 Mb/s for USB 2.0), improved power efficiency and management, increased power supply capability to devices, and optical as well as traditional USB-wire interconnection.

USB 3.0 is physically and functionally backward-compatible with USB 2.0 and can support devices complying with older specifications. USB 3.0 devices will operate in USB 2.0 modes with USB 2.0 hosts. Because SuperSpeed USB 3.0 is up to 10 times faster than its predecessor, transferring an HD movie (27GB) now takes about 70 seconds instead of 15 minutes with USB 2.0. This performance boost is most significant for Flash-based devices such as digital storage, cameras (digital and video), media players and mobile phones. As part of USB 3.0, a working group has been formed for the development of the next-generation mass storage specification named Mass Storage UASP. The throughput will be achieved by using a combined solution including a 3.0 stack and a UASP class driver.

“The integration of best-of-breed offerings from industry-leading suppliers speeds up SoC and ASIC development and shortens deployment cycles to users,” says Ophir Herbst, General Manager of Jungo’s Connectivity Software Division. “The electronics industry is in need of this type of strategic synergy.”

“Our collaboration with Jungo allows designers to have early access to high-quality IP and software solutions that help them successfully implement SuperSpeed USB 3.0 into their SoCs with less risk,” said Ed Bard, Senior Director of Marketing, DesignWare Digital IP & Memory at Synopsys. “By providing a fully interoperable hardware and software solution, we are enabling the design community to quickly benefit from the high throughput advantages of the SuperSpeed USB interface.”

http://www.jungo.com/st/news/pr090422.html ■