Known-good die for the
same cost as packaged ICs
One of the impediments to the use of known-good die (see Electronic Products,
May 1994, p. 25) is that it costs more than using packaged die. Intel Corp.
(Santa Clara, CA) is trying to overcome that by offering a range of existing
memory, peripheral, and microcontroller ICs in known-good die form for the same
price as their packaged equivalents.
Called SmartDie, the known-good die ICs (see table) will target the growing
number of users requiring bare tested and screened die. Being far smaller and
lighter than their packaged counterparts, the parts will be particularly
welcome in the rapidly growing market of small-form-factor products–embedded
PCs, mobile communications, PCMCIA cards, and small hard-disk drives.
The SmartDie ICs use a die-level burn-in process developed by Texas Instruments
(Dallas) and MicroModule Systems, a supplier of multichip products and services
located in Cupertino, CA. During burn-in and testing, the parts reside in a
temporary carrier. These carriers (see photo) allow the die to be tested and
burned in without bumping or other post-processing. Like their packaged
counterparts, the known-good die are tested to operate over the full 0 degrees
to +80 degreesC commercial range and meet all ac and dc parametric tests.
Initially, the SmartDie parts will be shipped in Gel-Pak packages that provide
surface and edge protection, as well as pre-orientation for automated die
attach. The moisture barrier bags into which the Gel-Paks are placed add
environmental protection. Intel is evaluating tape-and-reel packaging for the
future.
To assist users having little experience or lacking the facilities to handle
die-level products, Intel will offer additional manufacturing assistance
through a Technical Alliance Program (TAP) with assembly subcontractors. In
addition to manufacturing capability, some of the TAP participants will offer
design and layout services as well as direct chip attach capability. For more
information about SmartDie products, contact a local Intel sales office at
800-626-7256, call the Intel literature center at 800-548-4725, or .
–Spencer Chin
Photo CAPTION:
Intel's SmartDie ICs are tested and burned in with the help of die-level
burn-in carriers developed by Texas Instruments and MicroModule Systems. These
carriers eliminate the need for bumping or other post-processing.
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